COMCAS 2019 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in areas such as communications, antennas, Radar, RF and Microwave Circuits and Systems, and Bio-medical Engineering.
Following the previous COMCAS conferences, we expect more than 1600 participants from about 40 countries around the world.
IEEE COMCAS 2019 will deal with issues including: Innovations in Technology, Digital AESA Radar, MW Circuits modeling and Simulation, Space Oriented technology, Thermal Management, Advanced Packaging, 5G and "Internet of Things" communications.
We welcome the IEEE Electronic Packaging Society (EPS) to COMCAS 2019 and thank them for providing a Packaging and Thermal Management program Track, which addresses issues of critical interest to the electronic industry, such as Design & Reliability, Heterogeneous Integration, WLP, Flip Chip, new Materials & Processes, and an in-depth exploration of thermal management challenges and opportunities.
IEEE COMCAS 2019 will host the IEEE Young Professionals event, WIE Session (Women in Engineering) and COMCAS WirelessApps session.
Attractive workshops (invited sessions) and seminars are also very important part of the IEEE COMCAS 2019 and are included in the 3 days registration.
We welcome you; scientists, engineers, managers, and researchers from academic and industry to register and be part of this fascinating conference, share knowledge and interact with leading companies and experts. You will enjoy our warm hospitality and the beautiful Mediterranean coast of Tel Aviv.
Dear friends and colleagues,
The biennial IEEE Conference on Microwaves, Communications, Antennas, Electronic Systems and Bio-Medical Engineering has become a familiar regional event uniting these overlapping topical areas. We are proud to continue the tradition of a high-quality technical program, recognizing particularly the exceptional contributions of the late Prof. Roger Pollard, who was Program Co-Chair in 2009 and 2011. Roger is remembered with respect and gratitude by his many colleagues and friends.
This conference is co-sponsored by the IEEE Israel Section and AP/MTT chapter, AEAI (The Association of Engineers in Israel), and international societies and professional organizations like IEEE Region 8 the IEEE’s APS (Antennas and Propagation), AES (Aerospace and Electronic Systems), EPS (Electronic Packaging Society), EuMA (the European Microwave Association) and GAAS Association.
Reflecting this broad sponsorship, the program of this year’s conference continues to be broad and interdisciplinary. We have significantly increased the number of tutorials and of industry-oriented invited sessions, making this conference more relevant than ever. Emphasis continues to be on applications-oriented research and development, from antennas and devices to systems and software, including calibration and testing, automotive radar and communications, and “5G” cellular mobile. Colleagues developing the products and systems of tomorrow and students just beginning to enter these specialized areas should find this conference particularly helpful to their projects and careers. We are pleased to have strong industry patronage and participation. We are grateful for this vital support, and happy that our industry focus is recognized. Our keynote speakers, too, represent high levels of industry leadership.
The COMCAS 2019 scientific program will comprises approx. 230 technical presentations, talks and tutorials, arranged in 60 sessions over three days with up to 9 parallel sessions running concurrently for much of the time. The technical presentations, reviewed, selected and accepted from a larger group of submissions, will be submitted for inclusion to IEEE-Xplore®. Thanks are due to the members of our large Technical Program Committee for their reviews and suggestions.
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| Shmuel Auster, IEEE COMCAS General Chair |
Amir Boag, IEEE COMCAS Technical Program Chair
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